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IC package thermal warpage

Thermal-structural analysis of FCBGA packages using cloud DDM

 

8-2
Solid mechanics      •      Heat solid 

The challenge

Modern IC packages (like Flip-Chip BGAs) contain thousands of micro-features—solder balls, underfill layers, and routing tracks.

Simulating thermal warpage requires high-resolution 3D meshes that exceed the memory limits of desktop workstations. Engineers are often forced to use 2D approximations or symmetry assumptions, which compromises reliability predictions.

Approach with Quanscient Allsolve

The study utilized Domain Decomposition Method (DDM) on the cloud to solve the full high-fidelity 3D model without simplification.

The simulation included a Mesh Convergence Study to guarantee accuracy and a 2-Variable Parametric Sweep (Temperature vs. CTE) of 100 simultaneous runs to map the design space for structural integrity.

Key results

  • Scalability: By scaling from 1 node to 60 cloud nodes using DDM, the simulation runtime was reduced by over 85%.
  • High Throughput: Successfully executed 100 design variations in parallel, replacing weeks of sequential analysis with a single batch run.
  • Full Fidelity: Captured the z-displacement (warpage) of individual solder balls and substrate layers without artificial geometric simplification.
Allsolve's ability to run parallel simulations is particularly valuable for parametric studies and DOE. A total of 100 simulations were run in parallel, demonstrating a dramatic reduction in overall analysis time.