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Japanese

Accelerating semiconductor packaging design with cloud-based simulations

See how cloud computing with modern algorithms enable efficient design space exploration and optimized package performance

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Webinar key takeaways

  • See how engineers are leveraging cloud computing in semiconductor packaging design for faster simulations and optimized design
  • Discover how to reduce simulation runtimes significantly in semiconductor packaging simulations to enable more extensive design space exploration
  • Learn how to perform efficient design of experiments (DoE) by running multiple simulations in parallel to optimize package performance
  • See a live demonstration of a mechanical characterization simulation with cloud-based multiphysics platform Quanscient Allsolve, demonstrating warpage due to temperature changes

Who is this for?

This webinar is ideal for engineers, designers, managers, and researchers involved in semiconductor packaging development.

About our technical speaker

Rahul Nagaraja, Application Engineer at Quanscient, will be leading the technical discussion. He has extensive experience in applying advanced numerical techniques to complex multiphysics simulations and will provide insights into the benefits of cloud-based simulation for semiconductor packaging design.

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Capture the core insights in a downloadable format.

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Quanscient Allsolve

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In the live demo, we'll
  1. Explore use cases and workflow integration
  2. Discuss pricing and value
  3. Discover features and benefits

We'll get back to you within 1 business day.