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Accelerating nonlinear MEMS simulations with the harmonic balance method

See how harmonic balance is leveraged for solving nonlinear periodic problems in frequency domain for quicker, more precise results without transient analysis.

AI in MEMS, Flexible Ceramics, and Piezoelectric Thin Films

This episode explores the engineering behind piezoelectric thin films, flexible biomedical wearables, and the intersection of AI and MEMS.

Introduction to the guest

Dr. Sina Sadeghpour is the founder and CEO of ZeptoNova. With a background in MEMS and advanced electronics, Sina and his team provide design and prototyping services for next-generation sensors, including piezoelectric ultrasound transducers and flexible biomedical wearables. As a partner of Quanscient, they are also utilizing Quanscient Allsolve for their simulation work.

In this episode...

We explore the industry shift toward piezoelectric thin films and the mechanics behind designing flexible ceramics for biomedical applications.

We cover the inherent discrepancies between ideal computer models and real-world cleanroom manufacturing, how iterative simulation workflows bridge that gap, and the two-way relationship between AI and MEMS.

Key takeaways

ZeptoNova's role in MEMS

The company provides end-to-end micro-electromechanical systems design services, bridging the gap between initial concept prototypes and mass production.

The shift to piezoelectric thin films

The industry is actively replacing older electrostatic and magnetic MEMS with piezoelectric thin films due to their improved manufacturing reliability and performance.

Reducing medical imaging costs

Manufacturing disposable intravascular ultrasound catheters using MEMS technology can decrease current production costs by a full order of magnitude.

The role of material science

Minor variations in crystal orientation, interfaces, or temperature significantly impact device performance, making material engineering a critical pillar of early MEMS design.

Engineering flexible ceramics

By combining micro-scale ceramics with stretchable polymers, engineers can fabricate flexible sensors for applications like continuous cardiac monitoring and 360-degree catheters.

The simulation gap

Initial computer models assume ideal conditions and inherently fail to account for real-world cleanroom variables like thermal mismatch and material impurities.

Iterative modeling workflows

Engineers correct their computer models by establishing a loop where physical fabrication outcomes and flaws are continuously fed back into the simulation software.

Cloud-native processing

Simulating piezoelectric ultrasound requires exceptionally fine meshes and massive data processing, making cloud platforms like Quanscient Allsolve essential for running complex iterations in parallel rather than relying on local workstations.

Physical sensors for computing
As artificial intelligence systems advance, they increasingly depend on next-generation MEMS devices to capture the physical, environmental data required for training and operation.
Direct-to-chip cooling
With up to 30% of data center power consumed entirely by thermal management, MEMS-based microfluidics are being developed to provide direct liquid cooling for high-density servers.
Advanced micro-packaging
The ongoing miniaturization and integration of photonic and electronic circuits requires highly specialized packaging technologies that rely heavily on advanced micro-manufacturing.

Watch the full episode on YouTube

Timestamps to be added soon.